Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AHCT30BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AHCT30BQ-Q100SOT762-1DHVQFN1418.121885 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9353013851155126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0002331.0000000.001284
FillerSilver (Ag)7440-22-40.01744575.0000000.096265
PolymerAcrylic resinProprietary0.0013966.0000000.007701
Resin systemProprietary0.00418718.0000000.023104
subTotal0.023260100.0000000.128353
DieDoped siliconSilicon (Si)7440-21-30.156471100.0000000.863437
subTotal0.156471100.0000000.863437
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.74471097.47000037.218587
Iron (Fe)7439-89-60.1660752.4000000.916432
Phosphorus (P)7723-14-00.0020760.0300000.011455
Zinc (Zn)7440-66-60.0069200.1000000.038185
subTotal6.919780100.00000038.184659
Mould CompoundAdditiveNon hazardousProprietary0.3139172.9840001.732254
FillerSilica -amorphous-7631-86-90.3671483.4900002.025994
Silica fused60676-86-08.92307284.82000049.239207
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1054111.0020000.581675
PigmentCarbon black1333-86-40.0172530.1640000.095204
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.3893463.7010002.148483
Epoxy resin systemProprietary0.1668471.5860000.920695
Phenolic resinProprietary0.2370162.2530001.307898
subTotal10.520010100.00000058.051411
Pre-PlatingPure metal layerGold (Au)7440-57-50.0138423.0000000.076383
Nickel (Ni)7440-02-00.42587292.3000002.350044
Palladium (Pd)7440-05-30.0143033.1000000.078929
Silver (Ag)7440-22-40.0073821.6000000.040737
subTotal0.461400100.0000002.546093
WirePure metalCopper (Cu)7440-50-80.03955196.5500000.218248
Pure metal layerGold (Au)7440-57-50.0001430.3500000.000791
Palladium (Pd)7440-05-30.0012703.1000000.007007
subTotal0.040964100.0000000.226047
total18.121885100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.