Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AUP1G86GF

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Type numberPackagePackage descriptionTotal product weight
74AUP1G86GFSOT891XSON61.20618 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352811191327126030 s124020 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped SiliconSilicon (Si)7440-21-30.06291100.000005.21564
subTotal0.06291100.000005.21564
ComponentAdditiveNon hazardousProprietary0.001505.000000.12436
FillerAluminium Trioxide (Al2O3)1344-28-10.0120040.000000.99488
PolymerBisphenol-A Bisphenol-A Diglycidyl Ether copolymer25036-25-30.0045015.000000.37308
Bisphenol-A/Epichlorohydrin Epoxy resin (generic)25068-38-60.0030010.000000.24872
Resin systemProprietary0.0090030.000000.74616
subTotal0.03000100.000002.48720
Lead FrameCopper alloyCopper (Cu)7440-50-80.4670093.4000038.71727
Magnesium (Mg)7439-95-40.000750.150000.06218
Nickel (Ni) - cas no. 7440-02-07440-02-00.014552.910001.20629
Silicon (Si)7440-21-30.003150.630000.26116
Pure metal layerGold (Au)7440-57-50.000200.040000.01658
Nickel (Ni) - cas no. 7440-02-07440-02-00.013802.760001.14411
Palladium (Pd)7440-05-30.000550.110000.04560
subTotal0.50000100.0000041.45319
Mould CompoundFillerSilica -amorphous-7631-86-90.1160020.000009.61714
Silica fused60676-86-00.3741064.5000031.01527
Flame retardantMetal hydroxideProprietary0.017403.000001.44257
ImpuritySilicon Dioxide (SiO2)14808-60-70.002900.500000.24043
PigmentCarbon black1333-86-40.001740.300000.14426
PolymerPhenol Formaldehyde resin (generic)9003-35-40.012762.200001.05789
Phenolic resinProprietary0.014502.500001.20214
Tetramethylbiphenyl diglycidyl ether85954-11-60.040607.000003.36600
subTotal0.58000100.0000048.08570
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00005
Bismuth (Bi)7440-69-90.000000.001000.00002
Copper (Cu)7440-50-80.000000.001000.00002
Lead (Pb)7439-92-10.000000.005000.00008
Tin solderTin (Sn)7440-31-50.0200099.990001.65796
subTotal0.02000100.000001.65813
WireGold alloyGold (Au)7440-57-50.0131399.000001.08896
Palladium (Pd)7440-05-30.000131.000000.01100
subTotal0.01327100.000001.09996
total1.20618100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.