Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AUP2G32GF

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AUP2G32GFSOT1089XSON81.79290 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352914911155126030 s124020 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.10136100.000005.65313
subTotal0.10136100.000005.65313
ComponentAdditiveNon hazardousProprietary0.001005.000000.05578
FillerAluminium Trioxide (Al2O3)1344-28-10.0080040.000000.44620
PolymerBisphenol-A Bisphenol-A Diglycidyl Ether copolymer25036-25-30.0030015.000000.16733
Bisphenol-A/Epichlorohydrin Epoxy resin (generic)25068-38-60.0020010.000000.11155
Resin systemProprietary0.0060030.000000.33465
subTotal0.02000100.000001.11551
Lead FrameCopper alloyCopper (Cu)7440-50-80.6372495.1100035.54225
Magnesium (Mg)7439-95-40.001340.200000.07474
Nickel (Ni)7440-02-00.021243.170001.18462
Silicon (Si)7440-21-30.004620.690000.25785
Pure metal layerGold (Au)7440-57-50.000130.020000.00747
Nickel (Ni)7440-02-00.004960.740000.27654
Palladium (Pd)7440-05-30.000470.070000.02616
subTotal0.67000100.0000037.36963
Mould CompoundFillerSilica -amorphous-7631-86-90.1880020.0000010.48581
Silica fused60676-86-00.6063064.5000033.81672
Flame retardantMetal hydroxideProprietary0.028203.000001.57287
ImpuritySilicon Dioxide (SiO2)14808-60-70.004700.500000.26215
PigmentCarbon black1333-86-40.002820.300000.15729
PolymerPhenol Formaldehyde resin (generic)9003-35-40.020682.200001.15344
Phenolic resinProprietary0.023502.500001.31073
Tetramethylbiphenyl diglycidyl ether85954-11-60.065807.000003.67003
subTotal0.94000100.0000052.42904
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00005
Bismuth (Bi)7440-69-90.000000.001000.00002
Copper (Cu)7440-50-80.000000.001000.00002
Lead (Pb)7439-92-10.000000.005000.00008
Tin solderTin (Sn)7440-31-50.0300099.990001.67310
subTotal0.03000100.000001.67327
WireGold alloyGold (Au)7440-57-50.0312399.000001.74185
Palladium (Pd)7440-05-30.000321.000000.01759
subTotal0.03155100.000001.75944
total1.79290100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.