Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74HC4052BZ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HC4052BZSOT8016-1DHXQFN166.668734 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9356914991154126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.01150260.0000000.172477
ImpurityNon hazardousProprietary0.0000080.0395000.000114
PolymerResin systemProprietary0.00765939.9514100.114845
subTotal0.019170100.0000000.287435
DieDoped siliconSilicon (Si)7440-21-30.261344100.0000003.918943
subTotal0.261344100.0000003.918943
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-83.00220897.00000045.019163
Nickel (Ni)7440-02-00.0928523.0000001.392345
subTotal3.095060100.00000046.411508
Mould CompoundAdditiveNon hazardousProprietary0.0964662.9840001.446535
FillerSilica -amorphous-7631-86-90.1128233.4900001.691825
Silica fused60676-86-02.74202784.82000041.117655
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.0323921.0020000.485733
PigmentCarbon black1333-86-40.0053020.1640000.079501
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.1196443.7010001.794110
Epoxy resin systemProprietary0.0512721.5860000.768835
Phenolic resinProprietary0.0728342.2530001.092173
subTotal3.232760100.00000048.476367
Pre-PlatingPure metal layerGold (Au)7440-57-50.0001621.0000000.002426
Nickel (Ni)7440-02-00.01472491.0000000.220789
Palladium (Pd)7440-05-30.0012948.0000000.019410
subTotal0.016180100.0000000.242625
WirePure metalCopper (Cu)7440-50-80.04269596.5500000.640223
Pure metal layerGold (Au)7440-57-50.0001550.3500000.002321
Palladium (Pd)7440-05-30.0013713.1000000.020556
subTotal0.044220100.0000000.663100
total6.668734100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.