Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74HCT1G66GV

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HCT1G66GVSOT753SO510.524445 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93527188612519126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.01500075.0000000.142525
PolymerResin systemProprietary0.00500025.0000000.047508
subTotal0.020000100.0000000.190034
DieDoped siliconSilicon (Si)7440-21-30.162785100.0000001.546737
subTotal0.162785100.0000001.546737
Lead FrameCopper alloyCopper (Cu)7440-50-83.33977694.88000031.733512
Iron (Fe)7439-89-60.0894082.5400000.849527
Lead (Pb)7439-92-10.0010560.0300000.010034
Phosphorus (P)7723-14-00.0052800.1500000.050169
Tin (Sn)7440-31-50.0070400.2000000.066892
Pure metal layerSilver (Ag)7440-22-40.0774402.2000000.735811
subTotal3.520000100.00000033.445944
Mould CompoundFillerSilica fused60676-86-04.50850071.00000042.838363
PigmentCarbon black1333-86-40.0190500.3000000.181007
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.25095019.70000011.886137
Phenolic resinProprietary0.5715009.0000005.430215
subTotal6.350000100.00000060.335723
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000130.0030000.000125
Bismuth (Bi)7440-69-90.0000040.0010000.000042
Copper (Cu)7440-50-80.0000040.0010000.000042
Lead (Pb)7439-92-10.0000220.0050000.000209
Tin solderTin (Sn)7440-31-50.43995699.9900004.180325
subTotal0.440000100.0000004.180743
WireGold alloyGold (Au)7440-57-50.03134399.0000000.297815
Palladium (Pd)7440-05-30.0003171.0000000.003008
subTotal0.031660100.0000000.300823
total10.524445100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.