Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74LV1T00GW

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LV1T00GWSOT353-1UMT55.487247 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9356901141256126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00729075.0000000.132854
PolymerResin systemProprietary0.00243025.0000000.044285
subTotal0.009720100.0000000.177138
DieDoped siliconSilicon (Si)7440-21-30.072155100.0000001.314966
subTotal0.072155100.0000001.314966
Lead FrameCopper alloyCopper (Cu)7440-50-81.90774896.84000034.766942
Iron (Fe)7439-89-60.0455072.3100000.829323
Lead (Pb)7439-92-10.0001970.0100000.003590
Phosphorus (P)7723-14-00.0013790.0700000.025131
Zinc (Zn)7440-66-60.0023640.1200000.043082
Pure metal layerSilver (Ag)7440-22-40.0128050.6500000.233359
subTotal1.970000100.00000035.901427
Mould CompoundFillerSilica -amorphous-7631-86-91.09067735.07000019.876579
Silica fused60676-86-01.36342443.84000024.847141
PigmentCarbon black1333-86-40.0077750.2500000.141692
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.31100010.0000005.667687
Phenol Formaldehyde resin (generic)9003-35-40.3091349.9400005.633681
Polyethylene (PE) -wax-9002-88-40.0279900.9000000.510092
subTotal3.110000100.00000056.676873
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000090.0030000.000169
Bismuth (Bi)7440-69-90.0000030.0010000.000056
Copper (Cu)7440-50-80.0000030.0010000.000056
Lead (Pb)7439-92-10.0000160.0050000.000282
Tin solderTin (Sn)7440-31-50.30996999.9900005.648898
subTotal0.310000100.0000005.649463
WireImpurityNon hazardousProprietary0.0000020.0100000.000028
Pure metalCopper (Cu)7440-50-80.01537099.9900000.280112
subTotal0.015372100.0000000.280140
total5.487247100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.