Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74LVC273BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVC273BQ-Q100SOT764-1DHVQFN2028.332536 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9353024591155126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0008531.0000000.003010
FillerSilver (Ag)7440-22-40.06396075.0000000.225748
PolymerAcrylic resinProprietary0.0051176.0000000.018060
Resin systemProprietary0.01535018.0000000.054179
subTotal0.085280100.0000000.300997
DieDoped siliconSilicon (Si)7440-21-30.295537100.0000001.043102
subTotal0.295537100.0000001.043102
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.49847497.47000037.054481
Iron (Fe)7439-89-60.2585042.4000000.912391
Phosphorus (P)7723-14-00.0032310.0300000.011405
Zinc (Zn)7440-66-60.0107710.1000000.038016
subTotal10.770980100.00000038.016293
Mould CompoundAdditiveNon hazardousProprietary0.4886282.9840001.724617
FillerSilica -amorphous-7631-86-90.5714853.4900002.017062
Silica fused60676-86-013.88920784.82000049.022111
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1640771.0020000.579111
PigmentCarbon black1333-86-40.0268550.1640000.094785
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.6060363.7010002.139010
Epoxy resin systemProprietary0.2597061.5860000.916636
Phenolic resinProprietary0.3689272.2530001.302132
subTotal16.374920100.00000057.795462
Pre-PlatingPure metal layerGold (Au)7440-57-50.0215443.0000000.076038
Nickel (Ni)7440-02-00.66282592.3000002.339447
Palladium (Pd)7440-05-30.0222623.1000000.078573
Silver (Ag)7440-22-40.0114901.6000000.040554
subTotal0.718120100.0000002.534613
WirePure metalCopper (Cu)7440-50-80.08467396.5500000.298855
Pure metal layerGold (Au)7440-57-50.0003070.3500000.001083
Palladium (Pd)7440-05-30.0027193.1000000.009596
subTotal0.087699100.0000000.309534
total28.332536100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.