Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74LVC2G17GF

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Type numberPackagePackage descriptionTotal product weight
74LVC2G17GFSOT891XSON61.24166 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93528243413212126030 s124020 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.09055100.000007.29298
subTotal0.09055100.000007.29298
ComponentAdditiveNon hazardousProprietary0.001505.000000.12081
FillerAluminium Trioxide (Al2O3)1344-28-10.0120040.000000.96645
PolymerBisphenol-A Bisphenol-A Diglycidyl Ether copolymer25036-25-30.0045015.000000.36242
Bisphenol-A/Epichlorohydrin Epoxy resin (generic)25068-38-60.0030010.000000.24161
Resin systemProprietary0.0090030.000000.72484
subTotal0.03000100.000002.41613
Lead FrameCopper alloyCopper (Cu)7440-50-80.4670093.4000037.61094
Magnesium (Mg)7439-95-40.000750.150000.06040
Nickel (Ni) - cas no. 7440-02-07440-02-00.014552.910001.17182
Silicon (Si)7440-21-30.003150.630000.25369
Pure metal layerGold (Au)7440-57-50.000200.040000.01611
Nickel (Ni) - cas no. 7440-02-07440-02-00.013802.760001.11142
Palladium (Pd)7440-05-30.000550.110000.04430
subTotal0.50000100.0000040.26868
Mould CompoundFillerSilica -amorphous-7631-86-90.1160020.000009.34233
Silica fused60676-86-00.3741064.5000030.12902
Flame retardantMetal hydroxideProprietary0.017403.000001.40135
ImpuritySilicon Dioxide (SiO2)14808-60-70.002900.500000.23356
PigmentCarbon black1333-86-40.001740.300000.14013
PolymerPhenol Formaldehyde resin (generic)9003-35-40.012762.200001.02766
Phenolic resinProprietary0.014502.500001.16779
Tetramethylbiphenyl diglycidyl ether85954-11-60.040607.000003.26982
subTotal0.58000100.0000046.71166
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00005
Bismuth (Bi)7440-69-90.000000.001000.00002
Copper (Cu)7440-50-80.000000.001000.00002
Lead (Pb)7439-92-10.000000.005000.00008
Tin solderTin (Sn)7440-31-50.0200099.990001.61059
subTotal0.02000100.000001.61076
WireGold alloyGold (Au)7440-57-50.0209099.000001.68314
Palladium (Pd)7440-05-30.000211.000000.01700
subTotal0.02111100.000001.70014
total1.24166100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.