Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74LVC2G32GF

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVC2G32GFSOT1089XSON81.80224 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352915071154126030 s124020 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.11092100.000006.15443
subTotal0.11092100.000006.15443
ComponentAdditiveNon hazardousProprietary0.001005.000000.05549
FillerAluminium Trioxide (Al2O3)1344-28-10.0080040.000000.44389
PolymerBisphenol-A Bisphenol-A Diglycidyl Ether copolymer25036-25-30.0030015.000000.16646
Bisphenol-A/Epichlorohydrin Epoxy resin (generic)25068-38-60.0020010.000000.11097
Resin systemProprietary0.0060030.000000.33292
subTotal0.02000100.000001.10973
Lead FrameCopper alloyCopper (Cu)7440-50-80.6372495.1100035.35805
Magnesium (Mg)7439-95-40.001340.200000.07435
Nickel (Ni)7440-02-00.021243.170001.17848
Silicon (Si)7440-21-30.004620.690000.25651
Pure metal layerGold (Au)7440-57-50.000130.020000.00744
Nickel (Ni)7440-02-00.004960.740000.27510
Palladium (Pd)7440-05-30.000470.070000.02602
subTotal0.67000100.0000037.17595
Mould CompoundFillerSilica -amorphous-7631-86-90.1880020.0000010.43146
Silica fused60676-86-00.6063064.5000033.64147
Flame retardantMetal hydroxideProprietary0.028203.000001.56472
ImpuritySilicon Dioxide (SiO2)14808-60-70.004700.500000.26079
PigmentCarbon black1333-86-40.002820.300000.15647
PolymerPhenol Formaldehyde resin (generic)9003-35-40.020682.200001.14746
Phenolic resinProprietary0.023502.500001.30393
Tetramethylbiphenyl diglycidyl ether85954-11-60.065807.000003.65101
subTotal0.94000100.0000052.15731
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00005
Bismuth (Bi)7440-69-90.000000.001000.00002
Copper (Cu)7440-50-80.000000.001000.00002
Lead (Pb)7439-92-10.000000.005000.00008
Tin solderTin (Sn)7440-31-50.0300099.990001.66443
subTotal0.03000100.000001.66460
WireGold alloyGold (Au)7440-57-50.0310199.000001.72073
Palladium (Pd)7440-05-30.000311.000000.01738
subTotal0.03132100.000001.73811
total1.80224100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.