Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74LVT14BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVT14BQSOT762-1DHVQFN1417.952755 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93528559911510126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0002331.0000000.001296
FillerSilver (Ag)7440-22-40.01744575.0000000.097172
PolymerAcrylic resinProprietary0.0013966.0000000.007774
Resin systemProprietary0.00418718.0000000.023321
subTotal0.023260100.0000000.129562
DieDoped siliconSilicon (Si)7440-21-30.201428100.0000001.121992
subTotal0.201428100.0000001.121992
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.80297297.47000037.893751
Iron (Fe)7439-89-60.1675092.4000000.933056
Phosphorus (P)7723-14-00.0020940.0300000.011663
Zinc (Zn)7440-66-60.0069800.1000000.038877
subTotal6.979555100.00000038.877348
Mould CompoundAdditiveNon hazardousProprietary0.3139172.9840001.748572
FillerSilica -amorphous-7631-86-90.3671483.4900002.045079
Silica fused60676-86-08.92306484.82000049.703034
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1054101.0020000.587154
PigmentCarbon black1333-86-40.0172530.1640000.096101
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.3893453.7010002.168721
Epoxy resin systemProprietary0.1668471.5860000.929368
Phenolic resinProprietary0.2370162.2530001.320219
subTotal10.520000100.00000058.598249
Pre-PlatingPure metal layerGold (Au)7440-57-50.0017721.0000000.009869
Nickel (Ni)7440-02-00.16123091.0000000.898080
Palladium (Pd)7440-05-30.0141748.0000000.078952
subTotal0.177176100.0000000.986901
WirePure metalCopper (Cu)7440-50-80.04956496.5500000.276081
Pure metal layerGold (Au)7440-57-50.0001800.3500000.001001
Palladium (Pd)7440-05-30.0015913.1000000.008864
subTotal0.051335100.0000000.285946
total17.952755100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.