Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BAT54AW-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BAT54AW-QSOT323SC-705.545513 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346645121152126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.060000100.0000001.081956
subTotal0.060000100.0000001.081956
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0016650.0900000.030024
Carbon (C)7440-44-00.0007400.0400000.013344
Chromium (Cr)7440-47-30.0016650.0900000.030024
Cobalt (Co)7440-48-40.0079550.4300000.143449
Iron (Fe)7439-89-60.82602544.65000014.895376
Manganese (Mn)7439-96-50.0127650.6900000.230186
Nickel (Ni)7440-02-00.63899034.54000011.522649
Phosphorus (P)7723-14-00.0003700.0200000.006672
Silicon (Si)7440-21-30.0048100.2600000.086737
Sulphur (S)7704-34-90.0003700.0200000.006672
Pure metal layerCopper (Cu)7440-50-80.31172516.8500005.621211
Silver (Ag)7440-22-40.0429202.3200000.773959
subTotal1.850000100.00000033.360304
Mould CompoundFillerSilica fused60676-86-02.55340075.10000046.044433
PigmentCarbon black1333-86-40.0102000.3000000.183932
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.59500017.50000010.729395
Phenol Formaldehyde resin (generic)9003-35-40.2414007.1000004.353069
subTotal3.400000100.00000061.310829
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000070.0030000.000124
Bismuth (Bi)7440-69-90.0000020.0010000.000041
Copper (Cu)7440-50-80.0000020.0010000.000041
Lead (Pb)7439-92-10.0000120.0050000.000207
Tin solderTin (Sn)7440-31-50.22997799.9900004.147083
subTotal0.230000100.0000004.147497
WirePure metalCopper (Cu)7440-50-80.005513100.0000000.099414
subTotal0.005513100.0000000.099414
total5.545513100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.