Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BAT721A-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BAT721A-QSOT23TO-236AB7.866350 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346658242151126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.140000100.0000001.779733
subTotal0.140000100.0000001.779733
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0023520.0800000.029900
Carbon (C)7440-44-00.0011760.0400000.014950
Chromium (Cr)7440-47-30.0061740.2100000.078486
Cobalt (Co)7440-48-40.0123480.4200000.156972
Iron (Fe)7439-89-61.38180047.00000017.565961
Manganese (Mn)7439-96-50.0246960.8400000.313945
Nickel (Ni)7440-02-01.04105435.41000013.234270
Phosphorus (P)7723-14-00.0005880.0200000.007475
Silicon (Si)7440-21-30.0073500.2500000.093436
Sulphur (S)7704-34-90.0005880.0200000.007475
Pure metal layerCopper (Cu)7440-50-80.38220013.0000004.858670
Silver (Ag)7440-22-40.0796742.7100001.012846
subTotal2.940000100.00000037.374386
Mould CompoundAdditiveNon hazardousProprietary0.1324722.9000001.684034
Triphenylphosphine603-35-00.0022840.0500000.029035
FillerSilica -amorphous-7631-86-93.28896072.00000041.810497
PigmentCarbon black1333-86-40.0022840.0500000.029035
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.68520015.0000008.710520
Phenol Formaldehyde resin (generic)9003-35-40.45680010.0000005.807013
subTotal4.568000100.00000058.070134
Post-PlatingImpurityLead (Pb)7439-92-10.0000090.0045000.000109
Non hazardousProprietary0.0001050.0555000.001341
Tin solderTin (Sn)7440-31-50.18988699.9400002.413902
subTotal0.190000100.0000002.415351
WireImpurityNon hazardousProprietary0.0000030.0100000.000036
Pure metalCopper (Cu)7440-50-80.02834799.9900000.360360
subTotal0.028350100.0000000.360396
total7.866350100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.