Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BC56-10PA

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BC56-10PASOT1061HUSON37.491572 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340658091155126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.08800080.0000001.174653
PolymerAcrylic resinProprietary0.02200020.0000000.293663
subTotal0.110000100.0000001.468317
DieDoped siliconSilicon (Si)7440-21-30.130000100.0000001.735283
subTotal0.130000100.0000001.735283
Lead FrameCopper alloyCopper (Cu)7440-50-82.64136894.20000035.257860
Magnesium (Mg)7439-95-40.0084120.3000000.112286
Nickel (Ni)7440-02-00.0981403.5000001.310005
Silicon (Si)7440-21-30.0243950.8700000.325630
Pure metal layerGold (Au)7440-57-50.0011220.0400000.014971
Nickel (Ni)7440-02-00.0280401.0000000.374287
Palladium (Pd)7440-05-30.0025240.0900000.033686
subTotal2.804000100.00000037.428727
Mould CompoundAdditiveNon hazardousProprietary0.0174660.4100000.233142
FillerSilica -amorphous-7631-86-90.0123540.2900000.164905
Silica fused60676-86-03.66999086.15000048.988250
HardenerPhenolic resinProprietary0.1827544.2900002.439461
PigmentCarbon black1333-86-40.0080940.1900000.108041
PolymerEpoxy resin systemProprietary0.3693428.6700004.930100
subTotal4.260000100.00000056.863900
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000102
Non hazardousProprietary0.0000940.0555000.001259
Tin solderTin (Sn)7440-31-50.16989899.9400002.267855
subTotal0.170000100.0000002.269217
WireImpurityNon hazardousProprietary0.0000020.0100000.000023
Pure metalCopper (Cu)7440-50-80.01757099.9900000.234533
subTotal0.017572100.0000000.234557
total7.491572100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.