Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BC68PA

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BC68PASOT1061HUSON37.594628 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340657361155126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.08800080.0000001.158714
PolymerAcrylic resinProprietary0.02200020.0000000.289678
subTotal0.110000100.0000001.448392
DieDoped siliconSilicon (Si)7440-21-30.230000100.0000003.028456
subTotal0.230000100.0000003.028456
Lead FrameCopper alloyCopper (Cu)7440-50-82.64136894.20000034.779426
Magnesium (Mg)7439-95-40.0084120.3000000.110763
Nickel (Ni)7440-02-00.0981403.5000001.292229
Silicon (Si)7440-21-30.0243950.8700000.321211
Pure metal layerGold (Au)7440-57-50.0011220.0400000.014768
Nickel (Ni)7440-02-00.0280401.0000000.369208
Palladium (Pd)7440-05-30.0025240.0900000.033229
subTotal2.804000100.00000036.920834
Mould CompoundAdditiveNon hazardousProprietary0.0174660.4100000.229978
FillerSilica -amorphous-7631-86-90.0123540.2900000.162668
Silica fused60676-86-03.66999086.15000048.323499
HardenerPhenolic resinProprietary0.1827544.2900002.406359
PigmentCarbon black1333-86-40.0080940.1900000.106575
PolymerEpoxy resin systemProprietary0.3693428.6700004.863201
subTotal4.260000100.00000056.092280
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000101
Non hazardousProprietary0.0000940.0555000.001242
Tin solderTin (Sn)7440-31-50.16989899.9400002.237081
subTotal0.170000100.0000002.238424
WireImpurityNon hazardousProprietary0.0000020.0100000.000027
Pure metalCopper (Cu)7440-50-80.02062699.9900000.271586
subTotal0.020628100.0000000.271613
total7.594628100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.