Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BC817-25W

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BC817-25WSOT323-1 SOT323SC-705.565923 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93402193013514126030 s123520 s3
93402193011514126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.080000100.0000001.437318
subTotal0.080000100.0000001.437318
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0016650.0900000.029914
Carbon (C)7440-44-00.0007400.0400000.013295
Chromium (Cr)7440-47-30.0016650.0900000.029914
Cobalt (Co)7440-48-40.0079550.4300000.142923
Iron (Fe)7439-89-60.82602544.65000014.840755
Manganese (Mn)7439-96-50.0127650.6900000.229342
Nickel (Ni)7440-02-00.63899034.54000011.480396
Phosphorus (P)7723-14-00.0003700.0200000.006648
Silicon (Si)7440-21-30.0048100.2600000.086419
Sulphur (S)7704-34-90.0003700.0200000.006648
Pure metal layerCopper (Cu)7440-50-80.31172516.8500005.600598
Silver (Ag)7440-22-40.0429202.3200000.771121
subTotal1.850000100.00000033.237973
Mould CompoundFillerSilica fused60676-86-02.55340075.10000045.875590
PigmentCarbon black1333-86-40.0102000.3000000.183258
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.59500017.50000010.690051
Phenol Formaldehyde resin (generic)9003-35-40.2414007.1000004.337106
subTotal3.400000100.00000061.086005
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000070.0030000.000124
Bismuth (Bi)7440-69-90.0000020.0010000.000041
Copper (Cu)7440-50-80.0000020.0010000.000041
Lead (Pb)7439-92-10.0000120.0050000.000207
Tin solderTin (Sn)7440-31-50.22997799.9900004.131875
subTotal0.230000100.0000004.132289
WirePure metalCopper (Cu)7440-50-80.005923100.0000000.106411
subTotal0.005923100.0000000.106411
total5.565923100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.