Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BC847BQC

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BC847BQCSOT8009DFN1412D-32.47370 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346608851471126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0053276.000000.21506
PolymerBisphenol-F/Formaldehyde/Epichlorohydrin copolymer9003-36-50.0007310.470000.02963
Phenolic resinProprietary0.0009513.530000.03829
subTotal0.00700100.000000.28298
DieDoped siliconSilicon (Si)7440-21-30.03000100.000001.21276
subTotal0.03000100.000001.21276
Lead FrameCopper alloyCopper (Cu)7440-50-81.0895093.2792044.04338
Magnesium (Mg)7439-95-40.001700.145400.06865
Nickel (Ni) - cas no. 7440-02-07440-02-00.033982.908901.37349
Silicon (Si)7440-21-30.007360.630300.29761
Pure metal layerGold (Au)7440-57-50.000440.037300.01761
Nickel (Ni) - cas no. 7440-02-07440-02-00.033552.872201.35616
Palladium (Pd)7440-05-30.001480.126700.05982
subTotal1.16800100.0000047.21672
Mould CompoundAdditiveMisc. Phosphor compounds (generic)7723-14-00.001180.100000.04778
Non hazardousProprietary0.042553.600001.72018
FillerSilica fused60676-86-01.0401688.0000042.04875
PigmentCarbon black1333-86-40.002360.200000.09557
PolymerPhenolic resinProprietary0.048464.100001.95909
Tetramethylbiphenyl diglycidyl ether85954-11-60.047284.000001.91131
subTotal1.18200100.0000047.78268
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.010000.00034
Bismuth (Bi)7440-69-90.000020.020000.00067
Iron (Fe)7439-89-60.000010.010000.00034
Lead (Pb)7439-92-10.000010.010000.00034
Tin solderTin (Sn)7440-31-50.0829699.950003.35362
subTotal0.08300100.000003.35531
WireImpurityNon hazardousProprietary0.000000.010000.00001
Pure metalCopper (Cu)7440-50-80.0037099.990000.14956
subTotal0.00370100.000000.14957
total2.47370100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.