Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BSP250

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BSP250SOT223SC-73103.604058 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93403345013513126030 s123520 s3
93403345011514126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.10010077.0000000.096618
PolymerResin systemProprietary0.02990023.0000000.028860
subTotal0.130000100.0000000.125478
DieDoped siliconSilicon (Si)7440-21-31.143508100.0000001.103729
subTotal1.143508100.0000001.103729
Lead FrameCopper alloyCopper (Cu)7440-50-850.72514099.15000048.960573
Iron (Fe)7439-89-60.0511600.1000000.049380
Phosphorus (P)7723-14-00.0153480.0300000.014814
Pure metal layerSilver (Ag)7440-22-40.3683520.7200000.355538
subTotal51.160000100.00000049.380305
Mould CompoundFillerSilica fused60676-86-034.64090071.00000033.435852
PigmentCarbon black1333-86-40.1463700.3000000.141278
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-29.61163019.7000009.277272
Phenolic resinProprietary4.3911009.0000004.238347
subTotal48.790000100.00000047.092750
Post-PlatingImpurityLead (Pb)7439-92-10.0000990.0045000.000096
Non hazardousProprietary0.0012270.0555000.001184
Tin solderTin (Sn)7440-31-52.20867499.9400002.131841
subTotal2.210000100.0000002.133121
WirePure metalGold (Au)7440-57-50.170550100.0000000.164617
subTotal0.170550100.0000000.164617
total103.604058100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.