Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BUK9M8R5-40H

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BUK9M8R5-40HSOT1210mLFPAK36.310000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346608081152126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.900000100.0000002.478656
subTotal0.900000100.0000002.478656
ClipCopper alloyCopper (Cu)7440-50-85.68860099.80000015.666758
Iron (Fe)7439-89-60.0085500.1500000.023547
Phosphorus (P)7723-14-00.0028500.0500000.007849
subTotal5.700000100.00000015.698155
Lead FrameCopper alloyCopper (Cu)7440-50-813.87220099.80000038.204902
Iron (Fe)7439-89-60.0208500.1500000.057422
Phosphorus (P)7723-14-00.0069500.0500000.019141
subTotal13.900000100.00000038.281465
Mould CompoundFillerSilica fused60676-86-05.28860062.00000014.565134
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-21.32215015.5000003.641283
ImpuritySilicon Dioxide (SiO2)14808-60-70.0170600.2000000.046984
PigmentCarbon black1333-86-40.0426500.5000000.117461
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.1706002.0000000.469843
Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.93830011.0000002.584137
Phenolic resinProprietary0.7506408.8000002.067309
subTotal8.530000100.00000023.492151
Post-PlatingImpurityNon hazardousProprietary0.0003850.0100000.001060
Tin alloyTin (Sn)7440-31-53.84961599.99000010.602079
subTotal3.850000100.00000010.603140
Solder PasteLead alloyLead (Pb)7439-92-13.17275092.5000008.737951
Silver (Ag)7440-22-40.0857502.5000000.236161
Tin (Sn)7440-31-50.1715005.0000000.472322
subTotal3.430000100.0000009.446433
total36.310000100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.