Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BUK9Y12-100E

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BUK9Y12-100ESOT669LFPAK85.210000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340670351154126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-34.100000100.0000004.811642
subTotal4.100000100.0000004.811642
ClipCopper alloyCopper (Cu)7440-50-84.99338199.8676205.860088
Iron (Fe)7439-89-60.0049960.0999100.005863
Phosphorus (P)7723-14-00.0016240.0324700.001905
subTotal5.000000100.0000005.867856
Lead FrameCopper alloyCopper (Cu)7440-50-837.83797199.81000044.405552
Iron (Fe)7439-89-60.0568650.1500000.066735
Phosphorus (P)7723-14-00.0151640.0400000.017796
subTotal37.910000100.00000044.490083
Mould CompoundAdditiveNon hazardousProprietary1.3067405.8000001.533552
FillerSilica -amorphous-7631-86-91.4193906.3000001.665755
Silica fused60676-86-016.22160072.00000019.037202
Flame retardantAntimony Trioxide (Sb2O3)1309-64-40.4506002.0000000.528811
PigmentCarbon black1333-86-40.0675900.3000000.079322
PolymerBromophenol/Formaldehyde/Epichlorohydrin polymer68541-56-00.4956602.2000000.581692
Epoxy resin systemProprietary1.3518006.0000001.586434
Phenol Formaldehyde resin (generic)9003-35-41.2166205.4000001.427790
subTotal22.530000100.00000026.440559
Post-PlatingImpurityNon hazardousProprietary0.0003850.0100000.000452
Tin alloyTin (Sn)7440-31-53.84961599.9900004.517797
subTotal3.850000100.0000004.518249
Solder PasteLead alloyLead (Pb)7439-92-13.28375092.5000003.853714
Silver (Ag)7440-22-40.0887502.5000000.104154
Tin (Sn)7440-31-50.1775005.0000000.208309
subTotal3.550000100.0000004.166178
Solder PasteImpurityAntimony (Sb)7440-36-00.0024810.0300000.002912
Lead alloyLead (Pb)7439-92-17.64726992.4700008.974614
Silver (Ag)7440-22-40.2067502.5000000.242636
Tin (Sn)7440-31-50.4135005.0000000.485272
subTotal8.270000100.0000009.705434
total85.210000100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.