Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BZB784-C5V1

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BZB784-C5V1SOT323SC-705.493730 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340563041151312601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.080000100.0000001.456206
subTotal0.080000100.0000001.456206
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0016200.0900000.029488
Carbon (C)7440-44-00.0007200.0400000.013106
Chromium (Cr)7440-47-30.0037800.2100000.068806
Cobalt (Co)7440-48-40.0075600.4200000.137611
Iron (Fe)7439-89-60.84906047.17000015.455073
Manganese (Mn)7439-96-50.0153000.8500000.278499
Nickel (Ni)7440-02-00.63972035.54000011.644548
Phosphorus (P)7723-14-00.0003600.0200000.006553
Silicon (Si)7440-21-30.0045000.2500000.081912
Sulphur (S)7704-34-90.0003600.0200000.006553
Pure metal layerCopper (Cu)7440-50-80.23490013.0500004.275783
Silver (Ag)7440-22-40.0421202.3400000.766692
subTotal1.800000100.00000032.764624
Mould CompoundFillerSilica fused60676-86-02.55340075.10000046.478440
PigmentCarbon black1333-86-40.0102000.3000000.185666
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.59500017.50000010.830529
Phenol Formaldehyde resin (generic)9003-35-40.2414007.1000004.394100
subTotal3.400000100.00000061.888735
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000060.0030000.000115
Bismuth (Bi)7440-69-90.0000020.0010000.000038
Copper (Cu)7440-50-80.0000020.0010000.000038
Lead (Pb)7439-92-10.0000100.0050000.000191
Tin solderTin (Sn)7440-31-50.20997999.9900003.822157
subTotal0.210000100.0000003.822540
WirePure metalCopper (Cu)7440-50-80.003725100.0000000.067805
subTotal0.003725100.0000000.067805
total5.493730100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.