Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BZX8450-B11

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BZX8450-B11SOT23TO-236AB7.646688 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346662922152126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.030000100.0000000.392327
subTotal0.030000100.0000000.392327
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0022940.0900000.030001
Carbon (C)7440-44-00.0010200.0400000.013334
Chromium (Cr)7440-47-30.0056080.2200000.073336
Cobalt (Co)7440-48-40.0109610.4300000.143339
Iron (Fe)7439-89-61.22301047.98000015.993986
Manganese (Mn)7439-96-50.0219210.8600000.286678
Nickel (Ni)7440-02-00.92120936.14000012.047158
Phosphorus (P)7723-14-00.0005100.0200000.006667
Silicon (Si)7440-21-30.0066270.2600000.086670
Sulphur (S)7704-34-90.0005100.0200000.006667
Pure metal layerCopper (Cu)7440-50-80.28982111.3700003.790155
Silver (Ag)7440-22-40.0655092.5700000.856702
subTotal2.549000100.00000033.334693
Mould CompoundAdditiveNon hazardousProprietary0.1414912.9000001.850357
Triphenylphosphine603-35-00.0024400.0500000.031903
FillerSilica -amorphous-7631-86-93.51288072.00000045.939889
PigmentCarbon black1333-86-40.0024400.0500000.031903
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.73185015.0000009.570810
Phenol Formaldehyde resin (generic)9003-35-40.48790010.0000006.380540
subTotal4.879000100.00000063.805402
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000109
Non hazardousProprietary0.0001030.0555000.001343
Tin solderTin (Sn)7440-31-50.18488999.9400002.417896
subTotal0.185000100.0000002.419348
WirePure metalCopper (Cu)7440-50-80.003688100.0000000.048227
subTotal0.003688100.0000000.048227
total7.646688100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.