Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BZX8450-B3V0-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BZX8450-B3V0-QSOT23TO-236AB7.655688 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346664132152126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.039000100.0000000.509425
subTotal0.039000100.0000000.509425
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0022940.0900000.029966
Carbon (C)7440-44-00.0010200.0400000.013318
Chromium (Cr)7440-47-30.0056080.2200000.073250
Cobalt (Co)7440-48-40.0109610.4300000.143171
Iron (Fe)7439-89-61.22301047.98000015.975183
Manganese (Mn)7439-96-50.0219210.8600000.286341
Nickel (Ni)7440-02-00.92120936.14000012.032996
Phosphorus (P)7723-14-00.0005100.0200000.006659
Silicon (Si)7440-21-30.0066270.2600000.086568
Sulphur (S)7704-34-90.0005100.0200000.006659
Pure metal layerCopper (Cu)7440-50-80.28982111.3700003.785699
Silver (Ag)7440-22-40.0655092.5700000.855694
subTotal2.549000100.00000033.295505
Mould CompoundAdditiveNon hazardousProprietary0.1414912.9000001.848181
Triphenylphosphine603-35-00.0024400.0500000.031865
FillerSilica -amorphous-7631-86-93.51288072.00000045.885882
PigmentCarbon black1333-86-40.0024400.0500000.031865
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.73185015.0000009.559559
Phenol Formaldehyde resin (generic)9003-35-40.48790010.0000006.373039
subTotal4.879000100.00000063.730392
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000109
Non hazardousProprietary0.0001030.0555000.001341
Tin solderTin (Sn)7440-31-50.18488999.9400002.415054
subTotal0.185000100.0000002.416504
WirePure metalCopper (Cu)7440-50-80.003688100.0000000.048170
subTotal0.003688100.0000000.048170
total7.655688100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.