Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BZX84W-C56-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BZX84W-C56-QSOT323SC-705.496831 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934664645135212601235
934664645115112601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.070000100.0000001.273461
subTotal0.070000100.0000001.273461
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0016600.0900000.030192
Carbon (C)7440-44-00.0007380.0400000.013419
Chromium (Cr)7440-47-30.0016600.0900000.030192
Cobalt (Co)7440-48-40.0079290.4300000.144250
Iron (Fe)7439-89-60.81965844.45000014.911464
Manganese (Mn)7439-96-50.0127240.6900000.231472
Nickel (Ni)7440-02-00.63415234.39000011.536676
Phosphorus (P)7723-14-00.0003690.0200000.006709
Silicon (Si)7440-21-30.0047940.2600000.087221
Sulphur (S)7704-34-90.0003690.0200000.006709
Pure metal layerCopper (Cu)7440-50-80.32030317.3700005.827045
Silver (Ag)7440-22-40.0396462.1500000.721252
subTotal1.844000100.00000033.546602
Mould CompoundAdditiveNon hazardousProprietary0.0977302.9000001.777934
Triphenylphosphine603-35-00.0016850.0500000.030654
FillerSilica -amorphous-7631-86-92.42640072.00000044.141797
PigmentCarbon black1333-86-40.0016850.0500000.030654
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.50550015.0000009.196208
Phenol Formaldehyde resin (generic)9003-35-40.33700010.0000006.130805
subTotal3.370000100.00000061.308052
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000060.0030000.000115
Bismuth (Bi)7440-69-90.0000020.0010000.000038
Copper (Cu)7440-50-80.0000020.0010000.000038
Lead (Pb)7439-92-10.0000100.0050000.000191
Tin solderTin (Sn)7440-31-50.20997999.9900003.820001
subTotal0.210000100.0000003.820383
WirePure metalCopper (Cu)7440-50-80.002831100.0000000.051502
subTotal0.002831100.0000000.051502
total5.496831100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.