Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BZX884S-B3V3

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BZX884S-B3V3SOD882BDDFN1006-20.893000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346616783152126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.01444076.0000001.617021
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00198910.4700000.222766
Phenolic resinProprietary0.00257113.5300000.287872
subTotal0.019000100.0000002.127660
DieDoped siliconSilicon (Si)7440-21-30.028000100.0000003.135498
subTotal0.028000100.0000003.135498
Lead FrameCopper alloyCopper (Cu)7440-50-80.37762095.60000042.286674
Magnesium (Mg)7439-95-40.0005920.1500000.066349
Nickel (Ni)7440-02-00.0117712.9800001.318141
Silicon (Si)7440-21-30.0025680.6500000.287514
Pure metal layerGold (Au)7440-57-50.0000400.0100000.004423
Nickel (Ni)7440-02-00.0022520.5700000.252128
Palladium (Pd)7440-05-30.0001580.0400000.017693
subTotal0.395000100.00000044.232923
Mould CompoundFillerSilica -amorphous-7631-86-90.0337557.9800003.780000
Silica fused60676-86-00.33878980.09200037.938316
PigmentCarbon black1333-86-40.0039250.9280000.439579
PolymerEpoxy resin systemProprietary0.0357448.4500004.002632
Phenolic resinProprietary0.0107862.5500001.207895
subTotal0.423000100.00000047.368421
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000101
Non hazardousProprietary0.0000110.0555000.001243
Tin solderTin (Sn)7440-31-50.01998899.9400002.238298
subTotal0.020000100.0000002.239642
WireImpurityNon hazardousProprietary0.0000010.0100000.000090
Pure metalGold (Au)7440-57-50.00799999.9900000.895767
subTotal0.008000100.0000000.895857
total0.893000100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.