Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BZX884S-C36-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BZX884S-C36-QSOD882BDDFN1006-20.900480 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662926315112601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.01444076.0000001.603589
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00198910.4700000.220916
Phenolic resinProprietary0.00257113.5300000.285481
subTotal0.019000100.0000002.109986
DieDoped siliconSilicon (Si)7440-21-30.039000100.0000004.331023
subTotal0.039000100.0000004.331023
Lead FrameCopper alloyCopper (Cu)7440-50-80.37762095.60000041.935412
Magnesium (Mg)7439-95-40.0005920.1500000.065798
Nickel (Ni)7440-02-00.0117712.9800001.307192
Silicon (Si)7440-21-30.0025680.6500000.285126
Pure metal layerGold (Au)7440-57-50.0000400.0100000.004387
Nickel (Ni)7440-02-00.0022520.5700000.250033
Palladium (Pd)7440-05-30.0001580.0400000.017546
subTotal0.395000100.00000043.865494
Mould CompoundFillerSilica -amorphous-7631-86-90.0337557.9800003.748601
Silica fused60676-86-00.33878980.09200037.623174
PigmentCarbon black1333-86-40.0039250.9280000.435928
PolymerEpoxy resin systemProprietary0.0357448.4500003.969383
Phenolic resinProprietary0.0107862.5500001.197861
subTotal0.423000100.00000046.974947
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000100
Non hazardousProprietary0.0000110.0555000.001233
Tin solderTin (Sn)7440-31-50.01998899.9400002.219705
subTotal0.020000100.0000002.221038
WireImpurityNon hazardousProprietary0.0000000.0100000.000050
Pure metalGold (Au)7440-57-50.00448099.9900000.497463
subTotal0.004480100.0000000.497512
total0.900480100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.