Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BZX8850-B22

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BZX8850-B22SOD882DFN1006-20.924720 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346671443152126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00760076.0000000.821870
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00104710.4700000.113223
Phenolic resinProprietary0.00135313.5300000.146315
subTotal0.010000100.0000001.081408
DieDoped siliconSilicon (Si)7440-21-30.030000100.0000003.244225
subTotal0.030000100.0000003.244225
Lead FrameCopper alloyCopper (Cu)7440-50-80.38740994.49000041.894736
Magnesium (Mg)7439-95-40.0008200.2000000.088675
Nickel (Ni)7440-02-00.0129153.1500001.396639
Silicon (Si)7440-21-30.0028290.6900000.305930
Pure metal layerGold (Au)7440-57-50.0001230.0300000.013301
Nickel (Ni)7440-02-00.0052071.2700000.563089
Palladium (Pd)7440-05-30.0006970.1700000.075374
subTotal0.410000100.00000044.337745
Mould CompoundFillerSilica -amorphous-7631-86-90.10350023.00000011.192577
Silica fused60676-86-00.27000060.00000029.198028
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0135003.0000001.459901
Ion trapping agentBismuth (Bi)7440-69-90.0022500.5000000.243317
PigmentCarbon black1333-86-40.0022500.5000000.243317
PolymerEpoxy resin systemProprietary0.0315007.0000003.406437
Phenolic resinProprietary0.0270006.0000002.919803
subTotal0.450000100.00000048.663379
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000097
Non hazardousProprietary0.0000110.0555000.001200
Tin solderTin (Sn)7440-31-50.01998899.9400002.161519
subTotal0.020000100.0000002.162817
WireImpurityNon hazardousProprietary0.0000000.0100000.000051
Pure metalGold (Au)7440-57-50.00472099.9900000.510374
subTotal0.004720100.0000000.510425
total0.924720100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.