Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BZX8850S-B10-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BZX8850S-B10-QSOD882BDDFN1006-20.911588 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346666423152126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.01444076.0000001.584049
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00198910.4700000.218224
Phenolic resinProprietary0.00257113.5300000.282002
subTotal0.019000100.0000002.084275
DieDoped siliconSilicon (Si)7440-21-30.050000100.0000005.484934
subTotal0.050000100.0000005.484934
Lead FrameCopper alloyCopper (Cu)7440-50-80.37762095.60000041.424415
Magnesium (Mg)7439-95-40.0005920.1500000.064996
Nickel (Ni)7440-02-00.0117712.9800001.291263
Silicon (Si)7440-21-30.0025680.6500000.281651
Pure metal layerGold (Au)7440-57-50.0000400.0100000.004333
Nickel (Ni)7440-02-00.0022520.5700000.246987
Palladium (Pd)7440-05-30.0001580.0400000.017332
subTotal0.395000100.00000043.330978
Mould CompoundFillerSilica -amorphous-7631-86-90.0337557.9800003.702923
Silica fused60676-86-00.33878980.09200037.164724
PigmentCarbon black1333-86-40.0039250.9280000.430616
PolymerEpoxy resin systemProprietary0.0357448.4500003.921015
Phenolic resinProprietary0.0107862.5500001.183265
subTotal0.423000100.00000046.402541
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000099
Non hazardousProprietary0.0000110.0555000.001218
Tin solderTin (Sn)7440-31-50.01998899.9400002.192657
subTotal0.020000100.0000002.193974
WireImpurityNon hazardousProprietary0.0000000.0100000.000050
Pure metalGold (Au)7440-57-50.00458899.9900000.503302
subTotal0.004588100.0000000.503352
total0.911588100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.