Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BZX8850S-B20-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BZX8850S-B20-QSOD882BDDFN1006-20.891588 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346666493152126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.01444076.0000001.619582
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00198910.4700000.223119
Phenolic resinProprietary0.00257113.5300000.288328
subTotal0.019000100.0000002.131029
DieDoped siliconSilicon (Si)7440-21-30.030000100.0000003.364783
subTotal0.030000100.0000003.364783
Lead FrameCopper alloyCopper (Cu)7440-50-80.37762095.60000042.353643
Magnesium (Mg)7439-95-40.0005920.1500000.066454
Nickel (Ni)7440-02-00.0117712.9800001.320229
Silicon (Si)7440-21-30.0025680.6500000.287969
Pure metal layerGold (Au)7440-57-50.0000400.0100000.004430
Nickel (Ni)7440-02-00.0022520.5700000.252527
Palladium (Pd)7440-05-30.0001580.0400000.017721
subTotal0.395000100.00000044.302974
Mould CompoundFillerSilica -amorphous-7631-86-90.0337557.9800003.785986
Silica fused60676-86-00.33878980.09200037.998398
PigmentCarbon black1333-86-40.0039250.9280000.440275
PolymerEpoxy resin systemProprietary0.0357448.4500004.008971
Phenolic resinProprietary0.0107862.5500001.209808
subTotal0.423000100.00000047.443438
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000101
Non hazardousProprietary0.0000110.0555000.001245
Tin solderTin (Sn)7440-31-50.01998899.9400002.241843
subTotal0.020000100.0000002.243189
WireImpurityNon hazardousProprietary0.0000000.0100000.000051
Pure metalGold (Au)7440-57-50.00458899.9900000.514592
subTotal0.004588100.0000000.514644
total0.891588100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.