Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BZX8850S-C9V1-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BZX8850S-C9V1-QSOD882BDDFN1006-20.911560 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346634003152126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.01444076.0000001.584098
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00198910.4700000.218230
Phenolic resinProprietary0.00257113.5300000.282011
subTotal0.019000100.0000002.084339
DieDoped siliconSilicon (Si)7440-21-30.050000100.0000005.485102
subTotal0.050000100.0000005.485102
Lead FrameCopper alloyCopper (Cu)7440-50-80.37762095.60000041.425688
Magnesium (Mg)7439-95-40.0005920.1500000.064998
Nickel (Ni)7440-02-00.0117712.9800001.291303
Silicon (Si)7440-21-30.0025680.6500000.281660
Pure metal layerGold (Au)7440-57-50.0000400.0100000.004333
Nickel (Ni)7440-02-00.0022520.5700000.246994
Palladium (Pd)7440-05-30.0001580.0400000.017333
subTotal0.395000100.00000043.332309
Mould CompoundFillerSilica -amorphous-7631-86-90.0337557.9800003.703037
Silica fused60676-86-00.33878980.09200037.165865
PigmentCarbon black1333-86-40.0039250.9280000.430629
PolymerEpoxy resin systemProprietary0.0357448.4500003.921135
Phenolic resinProprietary0.0107862.5500001.183301
subTotal0.423000100.00000046.403967
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000099
Non hazardousProprietary0.0000110.0555000.001218
Tin solderTin (Sn)7440-31-50.01998899.9400002.192725
subTotal0.020000100.0000002.194041
WireImpurityNon hazardousProprietary0.0000000.0100000.000050
Pure metalGold (Au)7440-57-50.00456099.9900000.500191
subTotal0.004560100.0000000.500241
total0.911560100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.