Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content MMBZ33VZLS-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
MMBZ33VZLS-QSOD882BDDFN1006-20.907560 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934666843315212601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.01444076.0000001.591079
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00198910.4700000.219192
Phenolic resinProprietary0.00257113.5300000.283254
subTotal0.019000100.0000002.093525
DieDoped siliconSilicon (Si)7440-21-30.046000100.0000005.068535
subTotal0.046000100.0000005.068535
Lead FrameCopper alloyCopper (Cu)7440-50-80.37762095.60000041.608268
Magnesium (Mg)7439-95-40.0005920.1500000.065285
Nickel (Ni)7440-02-00.0117712.9800001.296994
Silicon (Si)7440-21-30.0025680.6500000.282901
Pure metal layerGold (Au)7440-57-50.0000400.0100000.004352
Nickel (Ni)7440-02-00.0022520.5700000.248083
Palladium (Pd)7440-05-30.0001580.0400000.017409
subTotal0.395000100.00000043.523293
Mould CompoundFillerSilica -amorphous-7631-86-90.0337557.9800003.719357
Silica fused60676-86-00.33878980.09200037.329671
PigmentCarbon black1333-86-40.0039250.9280000.432527
PolymerEpoxy resin systemProprietary0.0357448.4500003.938417
Phenolic resinProprietary0.0107862.5500001.188516
subTotal0.423000100.00000046.608489
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000099
Non hazardousProprietary0.0000110.0555000.001223
Tin solderTin (Sn)7440-31-50.01998899.9400002.202389
subTotal0.020000100.0000002.203711
WireImpurityNon hazardousProprietary0.0000000.0100000.000050
Pure metalGold (Au)7440-57-50.00456099.9900000.502396
subTotal0.004560100.0000000.502446
total0.907560100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.