Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content NX2301P

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
NX2301PSOT23TO-236AB7.984777 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934064624235412601235
934064624215812601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieAluminium alloyAluminium (Al)7429-90-50.0039242.1800000.049144
Doped siliconSilicon (Si)7440-21-30.16444891.3600002.059519
Gold alloyGold (Au)7440-57-50.0116286.4600000.145627
subTotal0.180000100.0000002.254290
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0024630.0900000.030850
Carbon (C)7440-44-00.0010950.0400000.013711
Chromium (Cr)7440-47-30.0060210.2200000.075411
Cobalt (Co)7440-48-40.0117690.4300000.147394
Iron (Fe)7439-89-61.31321347.98000016.446453
Manganese (Mn)7439-96-50.0235380.8600000.294788
Nickel (Ni)7440-02-00.98915236.14000012.387970
Phosphorus (P)7723-14-00.0005470.0200000.006856
Silicon (Si)7440-21-30.0071160.2600000.089122
Sulphur (S)7704-34-90.0005470.0200000.006856
Pure metal layerCopper (Cu)7440-50-80.31119711.3700003.897377
Silver (Ag)7440-22-40.0703412.5700000.880938
subTotal2.737000100.00000034.277726
Mould CompoundAdditiveNon hazardousProprietary0.1410852.9000001.766925
Triphenylphosphine603-35-00.0024320.0500000.030464
FillerSilica -amorphous-7631-86-93.50280072.00000043.868476
PigmentCarbon black1333-86-40.0024320.0500000.030464
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.72975015.0000009.139266
Phenol Formaldehyde resin (generic)9003-35-40.48650010.0000006.092844
subTotal4.865000100.00000060.928439
Post-PlatingImpurityLead (Pb)7439-92-10.0000090.0045000.000107
Non hazardousProprietary0.0001050.0555000.001321
Tin solderTin (Sn)7440-31-50.18988699.9400002.378100
subTotal0.190000100.0000002.379528
WirePure metalCopper (Cu)7440-50-80.012777100.0000000.160014
subTotal0.012777100.0000000.160014
total7.984777100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.