Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PDTA115TMB

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PDTA115TMBSOT883BXQFN30.710625 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934065935315612601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00228076.0000000.320844
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00031410.4700000.044201
Phenolic resinProprietary0.00040613.5300000.057119
subTotal0.003000100.0000000.422164
DieDoped siliconSilicon (Si)7440-21-30.060000100.0000008.443272
subTotal0.060000100.0000008.443272
Lead FrameCopper alloyChromium (Cr)7440-47-30.0006720.2400000.094565
Copper (Cu)7440-50-80.26320094.00000037.037819
Tin (Sn)7440-31-50.0006720.2400000.094565
Zinc (Zn)7440-66-60.0005880.2100000.082744
Pure metal layerGold (Au)7440-57-50.0002240.0800000.031522
Nickel (Ni)7440-02-00.0138324.9400001.946456
Palladium (Pd)7440-05-30.0008120.2900000.114266
subTotal0.280000100.00000039.401935
Mould CompoundFillerSilica -amorphous-7631-86-90.07820023.00000011.004398
Silica fused60676-86-00.20400060.00000028.707124
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0102003.0000001.435356
Ion trapping agentBismuth (Bi)7440-69-90.0017000.5000000.239226
PigmentCarbon black1333-86-40.0017000.5000000.239226
PolymerEpoxy resin systemProprietary0.0238007.0000003.349164
Phenolic resinProprietary0.0204006.0000002.870712
subTotal0.340000100.00000047.845207
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000127
Non hazardousProprietary0.0000110.0555000.001562
Tin solderTin (Sn)7440-31-50.01998899.9400002.812735
subTotal0.020000100.0000002.814424
WireImpurityNon hazardousProprietary0.0000010.0100000.000107
Pure metalGold (Au)7440-57-50.00762499.9900001.072892
subTotal0.007625100.0000001.072999
total0.710625100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.