Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PEMH1

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PEMH1SOT666SOT62.828650 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93405686211512126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.120000100.0000004.242306
subTotal0.120000100.0000004.242306
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0009280.0800000.032807
Carbon (C)7440-44-00.0004640.0400000.016404
Chromium (Cr)7440-47-30.0024360.2100000.086119
Cobalt (Co)7440-48-40.0048720.4200000.172238
Iron (Fe)7439-89-60.54172046.70000019.151185
Manganese (Mn)7439-96-50.0097440.8400000.344475
Nickel (Ni)7440-02-00.40808835.18000014.426953
Phosphorus (P)7723-14-00.0002320.0200000.008202
Silicon (Si)7440-21-30.0029000.2500000.102522
Sulphur (S)7704-34-90.0002320.0200000.008202
Pure metal layerCopper (Cu)7440-50-80.14975612.9100005.294257
Silver (Ag)7440-22-40.0386283.3300001.365598
subTotal1.160000100.00000041.008962
Mould CompoundFillerSilica fused60676-86-01.04262171.00000036.859307
PigmentCarbon black1333-86-40.0044050.3000000.155744
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.28929119.70000010.227160
Phenolic resinProprietary0.1321639.0000004.672307
subTotal1.468480100.00000051.914518
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000020.0030000.000068
Bismuth (Bi)7440-69-90.0000010.0010000.000023
Copper (Cu)7440-50-80.0000010.0010000.000023
Lead (Pb)7439-92-10.0000030.0050000.000113
Tin solderTin (Sn)7440-31-50.06369499.9900002.251732
subTotal0.063700100.0000002.251958
WireImpurityNon hazardousProprietary0.0000020.0100000.000058
Pure metalGold (Au)7440-57-50.01646899.9900000.582198
subTotal0.016470100.0000000.582257
total2.828650100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.