Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PESD24VS1UL

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD24VS1ULSOD882DFN1006-20.944240 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340599793031126030 s123520 s3
93405997931513126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00760076.0000000.804880
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00104710.4700000.110883
Phenolic resinProprietary0.00135313.5300000.143290
subTotal0.010000100.0000001.059053
DieDoped siliconSilicon (Si)7440-21-30.050000100.0000005.295264
subTotal0.050000100.0000005.295264
Lead FrameCopper alloyCopper (Cu)7440-50-80.38740994.49000041.028658
Magnesium (Mg)7439-95-40.0008200.2000000.086842
Nickel (Ni)7440-02-00.0129153.1500001.367767
Silicon (Si)7440-21-30.0028290.6900000.299606
Pure metal layerGold (Au)7440-57-50.0001230.0300000.013026
Nickel (Ni)7440-02-00.0052071.2700000.551449
Palladium (Pd)7440-05-30.0006970.1700000.073816
subTotal0.410000100.00000043.421164
Mould CompoundFillerSilica -amorphous-7631-86-90.10350023.00000010.961196
Silica fused60676-86-00.27000060.00000028.594425
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0135003.0000001.429721
Ion trapping agentBismuth (Bi)7440-69-90.0022500.5000000.238287
PigmentCarbon black1333-86-40.0022500.5000000.238287
PolymerEpoxy resin systemProprietary0.0315007.0000003.336016
Phenolic resinProprietary0.0270006.0000002.859443
subTotal0.450000100.00000047.657375
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000095
Non hazardousProprietary0.0000110.0555000.001176
Tin solderTin (Sn)7440-31-50.01998899.9400002.116835
subTotal0.020000100.0000002.118106
WireImpurityNon hazardousProprietary0.0000000.0100000.000045
Pure metalGold (Au)7440-57-50.00424099.9900000.448993
subTotal0.004240100.0000000.449038
total0.944240100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.