Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PESD30VF1BL

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD30VF1BLSOD882DFN1006-20.943965 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346607423154126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00760076.0000000.805115
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00104710.4700000.110915
Phenolic resinProprietary0.00135313.5300000.143332
subTotal0.010000100.0000001.059361
DieDoped siliconSilicon (Si)7440-21-30.050000100.0000005.296807
subTotal0.050000100.0000005.296807
Lead FrameCopper alloyCopper (Cu)7440-50-80.38740994.49000041.040611
Magnesium (Mg)7439-95-40.0008200.2000000.086868
Nickel (Ni)7440-02-00.0129153.1500001.368165
Silicon (Si)7440-21-30.0028290.6900000.299693
Pure metal layerGold (Au)7440-57-50.0001230.0300000.013030
Nickel (Ni)7440-02-00.0052071.2700000.551609
Palladium (Pd)7440-05-30.0006970.1700000.073837
subTotal0.410000100.00000043.433814
Mould CompoundFillerSilica -amorphous-7631-86-90.10350023.00000010.964390
Silica fused60676-86-00.27000060.00000028.602755
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0135003.0000001.430138
Ion trapping agentBismuth (Bi)7440-69-90.0022500.5000000.238356
PigmentCarbon black1333-86-40.0022500.5000000.238356
PolymerEpoxy resin systemProprietary0.0315007.0000003.336988
Phenolic resinProprietary0.0270006.0000002.860276
subTotal0.450000100.00000047.671259
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000095
Non hazardousProprietary0.0000110.0555000.001176
Tin solderTin (Sn)7440-31-50.01998899.9400002.117451
subTotal0.020000100.0000002.118723
WireImpurityNon hazardousProprietary0.0000000.0100000.000042
Pure metalGold (Au)7440-57-50.00396599.9900000.419995
subTotal0.003965100.0000000.420037
total0.943965100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.