Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PESD4USB3UBTBS-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD4USB3UBTBS-QSOT1176DDFN2510D5.213375 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346650691156126030 s123520 s3
9346650691185126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.04500045.0000000.863164
PolymerAcrylic resinProprietary0.01500015.0000000.287721
Phenolic resinProprietary0.01500015.0000000.287721
Resin systemProprietary0.02500025.0000000.479536
subTotal0.100000100.0000001.918143
DieDoped siliconSilicon (Si)7440-21-30.099000100.0000001.898962
subTotal0.099000100.0000001.898962
Lead FrameCopper alloyCopper (Cu)7440-50-81.91682495.84120036.767430
Iron (Fe)7439-89-60.0519392.5969700.996272
Phosphorus (P)7723-14-00.0029970.1498300.057479
Zinc (Zn)7440-66-60.0039950.1997700.076637
ImpurityLead (Pb)7439-92-10.0000560.0028000.001074
Pure metal layerSilver (Ag)7440-22-40.0241891.2094500.463980
subTotal2.000000100.00000038.362872
Mould CompoundFillerSilica -amorphous-7631-86-90.1540007.0000002.953941
Silica fused60676-86-01.82600083.00000035.025296
PigmentCarbon black1333-86-40.0110000.5000000.210996
PolymerEpoxy resin systemProprietary0.1320006.0000002.531949
Phenolic resinProprietary0.0770003.5000001.476970
subTotal2.200000100.00000042.199151
Post-PlatingImpurityNon hazardousProprietary0.0008000.1000000.015345
Tin solderTin (Sn)7440-31-50.79920099.90000015.329801
subTotal0.800000100.00000015.345146
WireImpurityNon hazardousProprietary0.0000000.0000500.000000
Silver (Ag)7440-22-40.0000000.0014500.000004
Pure metalCopper (Cu)7440-50-80.01387996.5485500.266213
Pure metal layerGold (Au)7440-57-50.0000650.4499600.001241
Palladium (Pd)7440-05-30.0004312.9997000.008271
subTotal0.014375100.0000000.275728
total5.213375100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.