Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PESD4USB5BTBS-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD4USB5BTBS-QSOT1176DDFN2510D5.224000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346661001155126030 s123520 s3
9346661001182126030 s124520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.04500045.0000000.861409
PolymerAcrylic resinProprietary0.01500015.0000000.287136
Phenolic resinProprietary0.01500015.0000000.287136
Resin systemProprietary0.02500025.0000000.478560
subTotal0.100000100.0000001.914242
DieDoped siliconSilicon (Si)7440-21-30.119000100.0000002.277948
subTotal0.119000100.0000002.277948
Lead FrameCopper alloyCopper (Cu)7440-50-81.91682495.84120036.692649
Iron (Fe)7439-89-60.0519392.5969700.994246
Phosphorus (P)7723-14-00.0029970.1498300.057362
Zinc (Zn)7440-66-60.0039950.1997700.076482
ImpurityLead (Pb)7439-92-10.0000560.0028000.001072
Pure metal layerSilver (Ag)7440-22-40.0241891.2094500.463036
subTotal2.000000100.00000038.284847
Mould CompoundFillerSilica -amorphous-7631-86-90.1540007.0000002.947933
Silica fused60676-86-01.82600083.00000034.954058
PigmentCarbon black1333-86-40.0110000.5000000.210567
PolymerEpoxy resin systemProprietary0.1320006.0000002.526799
Phenolic resinProprietary0.0770003.5000001.473966
subTotal2.200000100.00000042.113323
Post-PlatingImpurityNon hazardousProprietary0.0008000.1000000.015314
Tin solderTin (Sn)7440-31-50.79920099.90000015.298622
subTotal0.800000100.00000015.313936
WirePure metalGold (Au)7440-57-50.00495099.0000000.094755
Palladium (Pd)7440-05-30.0000501.0000000.000957
subTotal0.005000100.0000000.095712
total5.224000100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.