Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PESD4USB5UTBS-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD4USB5UTBS-QSOT1176DDFN2510D5.204000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346661011154126030 s123520 s3
9346661011182126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.04500045.0000000.864719
PolymerAcrylic resinProprietary0.01500015.0000000.288240
Phenolic resinProprietary0.01500015.0000000.288240
Resin systemProprietary0.02500025.0000000.480400
subTotal0.100000100.0000001.921599
DieDoped siliconSilicon (Si)7440-21-30.099000100.0000001.902383
subTotal0.099000100.0000001.902383
Lead FrameCopper alloyCopper (Cu)7440-50-81.91682495.84120036.833666
Iron (Fe)7439-89-60.0519392.5969700.998067
Phosphorus (P)7723-14-00.0029970.1498300.057583
Zinc (Zn)7440-66-60.0039950.1997700.076776
ImpurityLead (Pb)7439-92-10.0000560.0028000.001076
Pure metal layerSilver (Ag)7440-22-40.0241891.2094500.464816
subTotal2.000000100.00000038.431983
Mould CompoundFillerSilica -amorphous-7631-86-90.1540007.0000002.959262
Silica fused60676-86-01.82600083.00000035.088394
PigmentCarbon black1333-86-40.0110000.5000000.211376
PolymerEpoxy resin systemProprietary0.1320006.0000002.536510
Phenolic resinProprietary0.0770003.5000001.479631
subTotal2.200000100.00000042.275173
Post-PlatingImpurityNon hazardousProprietary0.0008000.1000000.015373
Tin solderTin (Sn)7440-31-50.79920099.90000015.357417
subTotal0.800000100.00000015.372790
WirePure metalGold (Au)7440-57-50.00495099.0000000.095119
Palladium (Pd)7440-05-30.0000501.0000000.000961
subTotal0.005000100.0000000.096080
total5.204000100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.