Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMC85XP

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMC85XPdummy POV SOT1118HUSON67.08120 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340662881156126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000781.000000.01102
FillerSilver (Ag)7440-22-40.0655284.000000.92527
PolymerBismaleimidodiphenylmethane resin 0.0078010.000000.11015
Isobornyl Methacrylate7534-94-30.003905.000000.05508
subTotal0.07800100.000001.10152
DieDoped siliconSilicon (Si)7440-21-30.06000100.000000.84731
subTotal0.06000100.000000.84731
DieAluminium alloyAluminium (Al)7429-90-50.000450.280000.00633
Doped siliconSilicon (Si)7440-21-30.1595599.720002.25318
subTotal0.16000100.000002.25951
Lead FrameCopper alloyCopper (Cu)7440-50-82.5594195.1100036.14373
Magnesium (Mg)7439-95-40.005380.200000.07600
Nickel (Ni)7440-02-00.085303.170001.20466
Silicon (Si)7440-21-30.018570.690000.26221
Pure metal layerGold (Au)7440-57-50.000540.020000.00760
Nickel (Ni)7440-02-00.019910.740000.28122
Palladium (Pd)7440-05-30.001880.070000.02660
subTotal2.69100100.0000038.00202
Mould CompoundFillerSilica -amorphous-7631-86-90.7776020.0000010.98119
Silica fused60676-86-02.5077664.5000035.41434
Flame retardantMetal hydroxideProprietary0.116643.000001.64718
ImpuritySilicon Dioxide (SiO2)14808-60-70.019440.500000.27453
PigmentCarbon black1333-86-40.011660.300000.16472
PolymerPhenol Formaldehyde resin (generic)9003-35-40.085542.200001.20793
Phenolic resinProprietary0.097202.500001.37265
Tetramethylbiphenyl diglycidyl ether85954-11-60.272167.000003.84342
subTotal3.88800100.0000054.90596
Post-PlatingImpurityAntimony (Sb)7440-36-00.000020.010000.00023
Bismuth (Bi)7440-69-90.000030.020000.00046
Iron (Fe)7439-89-60.000020.010000.00023
Lead (Pb)7439-92-10.000020.010000.00023
Tin solderTin (Sn)7440-31-50.1639299.950002.31483
subTotal0.16400100.000002.31598
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalGold (Au)7440-57-50.0216099.990000.30500
subTotal0.02160100.000000.30503
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalGold (Au)7440-57-50.0186099.990000.26264
subTotal0.01860100.000000.26267
total7.08120100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.