Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMDPB30XN

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMDPB30XNSOT1118HUSON67.299420 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340665811841126030 s123520 s3
9340665811154126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.06240080.0000000.854862
PolymerAcrylic resinProprietary0.01560020.0000000.213716
subTotal0.078000100.0000001.068578
DieDoped siliconSilicon (Si)7440-21-30.320000100.0000004.383910
subTotal0.320000100.0000004.383910
Lead FrameCopper alloyCopper (Cu)7440-50-82.55941095.11000035.063198
Magnesium (Mg)7439-95-40.0053820.2000000.073732
Nickel (Ni)7440-02-00.0853053.1700001.168650
Silicon (Si)7440-21-30.0185680.6900000.254375
Pure metal layerGold (Au)7440-57-50.0005380.0200000.007373
Nickel (Ni)7440-02-00.0199130.7400000.272808
Palladium (Pd)7440-05-30.0018840.0700000.025806
subTotal2.691000100.00000036.865943
Mould CompoundFillerSilica -amorphous-7631-86-90.89424023.00000012.250836
Silica fused60676-86-02.33280060.00000031.958704
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.1166403.0000001.597935
Ion trapping agentBismuth (Bi)7440-69-90.0194400.5000000.266323
PigmentCarbon black1333-86-40.0194400.5000000.266323
PolymerEpoxy resin systemProprietary0.2721607.0000003.728515
Phenolic resinProprietary0.2332806.0000003.195870
subTotal3.888000100.00000053.264506
Post-PlatingImpurityLead (Pb)7439-92-10.0000070.0045000.000101
Non hazardousProprietary0.0000910.0555000.001247
Tin solderTin (Sn)7440-31-50.16390299.9400002.245406
subTotal0.164000100.0000002.246754
WireImpurityNon hazardousProprietary0.0000010.0100000.000020
Pure metalGold (Au)7440-57-50.01439999.9900000.197256
subTotal0.014400100.0000000.197276
WirePure metalGold (Au)7440-57-50.144020100.0000001.973033
subTotal0.144020100.0000001.973033
total7.299420100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.