Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMEG45U10EPD

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMEG45U10EPDSOT1289CFP1574.520000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340682061394126030 s123520 s3Leaded
9340682061464126030 s123520 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-32.910000100.0000003.904992
subTotal2.910000100.0000003.904992
ClipCopper alloyCopper (Cu)7440-50-87.34822499.8400009.860741
Iron (Fe)7439-89-60.0088320.1200000.011852
Phosphorus (P)7723-14-00.0022080.0300000.002963
MetallisationCopper (Cu)7440-50-80.0007360.0100000.000988
subTotal7.360000100.0000009.876543
Lead FrameCopper alloyCopper (Cu)7440-50-833.85298798.21000045.428056
Iron (Fe)7439-89-60.0034470.0100000.004626
Phosphorus (P)7723-14-00.0137880.0400000.018502
Pure metal layerCopper (Cu)7440-50-80.0275760.0800000.037005
Silver (Ag)7440-22-40.5722021.6600000.767850
subTotal34.470000100.00000046.256039
Mould CompoundFillerSilica fused60676-86-014.66860071.00000019.684112
PigmentCarbon black1333-86-40.0619800.3000000.083172
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-24.07002019.7000005.461648
Phenolic resinProprietary1.8594009.0000002.495169
subTotal20.660000100.00000027.724101
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000030.0030000.000004
Bismuth (Bi)7440-69-90.0000010.0010000.000001
Copper (Cu)7440-50-80.0000010.0010000.000001
Lead (Pb)7439-92-10.0000040.0050000.000006
Tin solderTin (Sn)7440-31-50.08999199.9900000.120761
subTotal0.090000100.0000000.120773
Solder PasteLead alloyLead (Pb)7439-92-18.62365095.50000011.572262
Silver (Ag)7440-22-40.2257502.5000000.302939
Tin (Sn)7440-31-50.1806002.0000000.242351
subTotal9.030000100.00000012.117552
total74.520000100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.