Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMPB29XPE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMPB29XPESOT1220DFN2020MD-67.415085 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340668731157126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.05600080.0000000.755217
PolymerAcrylic resinProprietary0.01400020.0000000.188804
subTotal0.070000100.0000000.944022
DieDoped siliconSilicon (Si)7440-21-30.520000100.0000007.012731
subTotal0.520000100.0000007.012731
Lead FrameCopper alloyCopper (Cu)7440-50-82.70491393.59560036.478514
Magnesium (Mg)7439-95-40.0042170.1459000.056864
Nickel (Ni)7440-02-00.0843532.9188001.137591
Silicon (Si)7440-21-30.0182760.6324000.246475
Pure metal layerGold (Au)7440-57-50.0009620.0333000.012979
Nickel (Ni)7440-02-00.0740132.5610000.998140
Palladium (Pd)7440-05-30.0032660.1130000.044041
subTotal2.890000100.00000038.974604
Mould CompoundFillerSilica -amorphous-7631-86-90.85790023.00000011.569658
Silica fused60676-86-02.23800060.00000030.181717
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.1119003.0000001.509086
Ion trapping agentBismuth (Bi)7440-69-90.0186500.5000000.251514
PigmentCarbon black1333-86-40.0186500.5000000.251514
PolymerEpoxy resin systemProprietary0.2611007.0000003.521200
Phenolic resinProprietary0.2238006.0000003.018172
subTotal3.730000100.00000050.302862
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000103
Non hazardousProprietary0.0000940.0555000.001272
Tin solderTin (Sn)7440-31-50.16989899.9400002.291248
subTotal0.170000100.0000002.292624
WireImpurityNon hazardousProprietary0.0000040.0100000.000047
Pure metalCopper (Cu)7440-50-80.03508199.9900000.473110
subTotal0.035085100.0000000.473157
total7.415085100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.