Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMPB95ENEA

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMPB95ENEASOT1220DFN2020MD-67.368594 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340674761154126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.05600080.0000000.759982
PolymerAcrylic resinProprietary0.01400020.0000000.189996
subTotal0.070000100.0000000.949978
DieDoped siliconSilicon (Si)7440-21-30.470000100.0000006.378422
subTotal0.470000100.0000006.378422
Lead FrameCopper alloyCopper (Cu)7440-50-82.70491393.59560036.708670
Magnesium (Mg)7439-95-40.0042170.1459000.057223
Nickel (Ni)7440-02-00.0843532.9188001.144768
Silicon (Si)7440-21-30.0182760.6324000.248030
Pure metal layerGold (Au)7440-57-50.0009620.0333000.013060
Nickel (Ni)7440-02-00.0740132.5610001.004437
Palladium (Pd)7440-05-30.0032660.1130000.044319
subTotal2.890000100.00000039.220508
Mould CompoundFillerSilica -amorphous-7631-86-90.85790023.00000011.642655
Silica fused60676-86-02.23800060.00000030.372144
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.1119003.0000001.518607
Ion trapping agentBismuth (Bi)7440-69-90.0186500.5000000.253101
PigmentCarbon black1333-86-40.0186500.5000000.253101
PolymerEpoxy resin systemProprietary0.2611007.0000003.543417
Phenolic resinProprietary0.2238006.0000003.037214
subTotal3.730000100.00000050.620240
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000104
Non hazardousProprietary0.0000940.0555000.001280
Tin solderTin (Sn)7440-31-50.16989899.9400002.305704
subTotal0.170000100.0000002.307089
WireImpurityNon hazardousProprietary0.0000040.0100000.000052
Pure metalCopper (Cu)7440-50-80.03859099.9900000.523704
subTotal0.038594100.0000000.523757
total7.368594100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.