Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMZ390UN

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMZ390UNSOT883XQFN30.878000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340601563151412601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00760076.0000000.865604
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00104710.4700000.119248
Phenolic resinProprietary0.00135313.5300000.154100
subTotal0.010000100.0000001.138952
DieDoped siliconSilicon (Si)7440-21-30.050000100.0000005.694761
subTotal0.050000100.0000005.694761
Lead FrameCopper alloyCopper (Cu)7440-50-80.40166393.41000045.747494
Magnesium (Mg)7439-95-40.0006280.1460000.071503
Nickel (Ni)7440-02-00.0125262.9130001.426640
Silicon (Si)7440-21-30.0027130.6310000.309032
MetallisationGold (Au)7440-57-50.0001500.0350000.017141
Nickel (Ni)7440-02-00.0118462.7550001.349260
Palladium (Pd)7440-05-30.0004730.1100000.053872
subTotal0.430000100.00000048.974943
Mould CompoundFillerSilica -amorphous-7631-86-90.08510023.0000009.692483
Silica fused60676-86-00.22200060.00000025.284738
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0111003.0000001.264237
Ion trapping agentBismuth (Bi)7440-69-90.0018500.5000000.210706
PigmentCarbon black1333-86-40.0018500.5000000.210706
PolymerEpoxy resin systemProprietary0.0259007.0000002.949886
Phenolic resinProprietary0.0222006.0000002.528474
subTotal0.370000100.00000042.141230
Post-PlatingImpurityLead (Pb)7439-92-10.0000000.0045000.000051
Non hazardousProprietary0.0000060.0555000.000632
Tin solderTin (Sn)7440-31-50.00999499.9400001.138269
subTotal0.010000100.0000001.138952
WireImpurityNon hazardousProprietary0.0000010.0100000.000091
Pure metalGold (Au)7440-57-50.00799999.9900000.911071
subTotal0.008000100.0000000.911162
total0.878000100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.