Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PSMN0R9-30YLD/2

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PSMN0R9-30YLD/2SOT1023LFPAK56E118.780000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346675071151126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-35.100000100.0000004.293652
subTotal5.100000100.0000004.293652
ClipCopper alloyCopper (Cu)7440-50-827.36372899.86762023.037319
Iron (Fe)7439-89-60.0273750.0999100.023047
Phosphorus (P)7723-14-00.0088970.0324700.007490
subTotal27.400000100.00000023.067857
Lead FrameCopper alloyCopper (Cu)7440-50-840.34748099.87000033.968244
Iron (Fe)7439-89-60.0404000.1000000.034012
Phosphorus (P)7723-14-00.0121200.0300000.010204
subTotal40.400000100.00000034.012460
Mould CompoundFillerSilica fused60676-86-021.54140071.00000018.135545
PigmentCarbon black1333-86-40.0910200.3000000.076629
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-25.97698019.7000005.031975
Phenolic resinProprietary2.7306009.0000002.298872
subTotal30.340000100.00000025.543021
Post-PlatingImpurityNon hazardousProprietary0.0001730.0100000.000146
Tin alloyTin (Sn)7440-31-51.72982799.9900001.456329
subTotal1.730000100.0000001.456474
Solder PasteLead alloyLead (Pb)7439-92-13.83875092.5000003.231815
Silver (Ag)7440-22-40.1037502.5000000.087346
Tin (Sn)7440-31-50.2075005.0000000.174693
subTotal4.150000100.0000003.493854
Solder PasteImpurityAntimony (Sb)7440-36-00.0028980.0300000.002440
Lead alloyLead (Pb)7439-92-18.93260292.4700007.520291
Silver (Ag)7440-22-40.2415002.5000000.203317
Tin (Sn)7440-31-50.4830005.0000000.406634
subTotal9.660000100.0000008.132682
total118.780000100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.