Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PTVS22VU1UPA

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PTVS22VU1UPASOT1061HUSON38.077505 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340712061475126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.08800080.0000001.089445
PolymerAcrylic resinProprietary0.02200020.0000000.272361
subTotal0.110000100.0000001.361807
DieDoped siliconSilicon (Si)7440-21-30.690000100.0000008.542242
subTotal0.690000100.0000008.542242
Lead FrameCopper alloyCopper (Cu)7440-50-82.64136894.20000032.700295
Magnesium (Mg)7439-95-40.0084120.3000000.104141
Nickel (Ni)7440-02-00.0981403.5000001.214979
Silicon (Si)7440-21-30.0243950.8700000.302009
Pure metal layerGold (Au)7440-57-50.0011220.0400000.013885
Nickel (Ni)7440-02-00.0280401.0000000.347137
Palladium (Pd)7440-05-30.0025240.0900000.031242
subTotal2.804000100.00000034.713689
Mould CompoundAdditiveNon hazardousProprietary0.0174660.4100000.216230
FillerSilica -amorphous-7631-86-90.0123540.2900000.152943
Silica fused60676-86-03.66999086.15000045.434698
HardenerPhenolic resinProprietary0.1827544.2900002.262506
PigmentCarbon black1333-86-40.0080940.1900000.100204
PolymerEpoxy resin systemProprietary0.3693428.6700004.572476
subTotal4.260000100.00000052.739057
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000095
Non hazardousProprietary0.0000940.0555000.001168
Tin solderTin (Sn)7440-31-50.16989899.9400002.103348
subTotal0.170000100.0000002.104610
WireImpurityNon hazardousProprietary0.0000040.0100000.000054
Pure metalCopper (Cu)7440-50-80.04350199.9900000.538546
subTotal0.043505100.0000000.538599
total8.077505100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.