Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PUMB9

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PUMB9SOT363SC-885.472926 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340575061258126030 s123520 s3
93405750611515126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.100000100.0000001.827176
subTotal0.100000100.0000001.827176
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0018630.0900000.034040
Carbon (C)7440-44-00.0008280.0400000.015129
Chromium (Cr)7440-47-30.0043470.2100000.079427
Cobalt (Co)7440-48-40.0089010.4300000.162637
Iron (Fe)7439-89-60.98118047.40000017.927887
Manganese (Mn)7439-96-50.0175950.8500000.321492
Nickel (Ni)7440-02-00.73919735.71000013.506431
Phosphorus (P)7723-14-00.0004140.0200000.007565
Silicon (Si)7440-21-30.0053820.2600000.098339
Sulphur (S)7704-34-90.0004140.0200000.007565
Pure metal layerCopper (Cu)7440-50-80.27137713.1100004.958536
Silver (Ag)7440-22-40.0385021.8600000.703499
subTotal2.070000100.00000037.822547
Mould CompoundFillerSilica fused60676-86-02.19292075.10000040.068512
PigmentCarbon black1333-86-40.0087600.3000000.160061
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.51100017.5000009.336870
Phenol Formaldehyde resin (generic)9003-35-40.2073207.1000003.788102
subTotal2.920000100.00000053.353544
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000110.0030000.000203
Bismuth (Bi)7440-69-90.0000040.0010000.000068
Copper (Cu)7440-50-80.0000040.0010000.000068
Lead (Pb)7439-92-10.0000180.0050000.000338
Tin solderTin (Sn)7440-31-50.36996399.9900006.759876
subTotal0.370000100.0000006.760552
WirePure metalCopper (Cu)7440-50-80.012926100.0000000.236176
subTotal0.012926100.0000000.236176
total5.472926100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.