Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PUSB3TB6

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PUSB3TB6SOT1358-1XSON72.645744 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93406823847113126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveActive agent2-Phenyl-4,5-bis(hydroxymethyl)imidazole61698-32-60.0015005.0000000.056695
FillerSilica -amorphous-7631-86-90.01800060.0000000.680338
PolymerBisphenol A-epichlorohydrin resin25068-38-60.00600020.0000000.226779
Phenol, polymer with 3a,4,7,7a-tetrahydro-4,7-methano-1H-indene, glycidyl ether119345-05-00.00450015.0000000.170084
subTotal0.030000100.0000001.133897
DieDoped siliconSilicon (Si)7440-21-30.080000100.0000003.023724
subTotal0.080000100.0000003.023724
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-80.85360097.00000032.263137
Nickel (Ni)7440-02-00.0264003.0000000.997829
subTotal0.880000100.00000033.260966
Mould CompoundFillerSilica -amorphous-7631-86-90.1120007.0000004.233214
Silica fused60676-86-01.32800083.00000050.193821
PigmentCarbon black1333-86-40.0080000.5000000.302372
PolymerEpoxy resin systemProprietary0.0960006.0000003.628469
Phenolic resinProprietary0.0560003.5000002.116607
subTotal1.600000100.00000060.474483
Pre-PlatingPure metal layerGold (Au)7440-57-50.0012003.0000000.045356
Nickel (Ni)7440-02-00.03692092.3000001.395449
Palladium (Pd)7440-05-30.0012403.1000000.046868
Silver (Ag)7440-22-40.0006401.6000000.024190
subTotal0.040000100.0000001.511862
WirePure metalGold (Au)7440-57-50.01558799.0000000.589118
Palladium (Pd)7440-05-30.0001571.0000000.005951
subTotal0.015744100.0000000.595069
total2.645744100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.