Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PZU3.3BL

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PZU3.3BLSOD882DFN1006-20.924560 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93406165731511126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00760076.0000000.822013
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00104710.4700000.113243
Phenolic resinProprietary0.00135313.5300000.146340
subTotal0.010000100.0000001.081596
DieDoped siliconSilicon (Si)7440-21-30.030000100.0000003.244787
subTotal0.030000100.0000003.244787
Lead FrameCopper alloyCopper (Cu)7440-50-80.38740994.49000041.901986
Magnesium (Mg)7439-95-40.0008200.2000000.088691
Nickel (Ni)7440-02-00.0129153.1500001.396881
Silicon (Si)7440-21-30.0028290.6900000.305983
Pure metal layerGold (Au)7440-57-50.0001230.0300000.013304
Nickel (Ni)7440-02-00.0052071.2700000.563187
Palladium (Pd)7440-05-30.0006970.1700000.075387
subTotal0.410000100.00000044.345418
Mould CompoundFillerSilica -amorphous-7631-86-90.10350023.00000011.194514
Silica fused60676-86-00.27000060.00000029.203080
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0135003.0000001.460154
Ion trapping agentBismuth (Bi)7440-69-90.0022500.5000000.243359
PigmentCarbon black1333-86-40.0022500.5000000.243359
PolymerEpoxy resin systemProprietary0.0315007.0000003.407026
Phenolic resinProprietary0.0270006.0000002.920308
subTotal0.450000100.00000048.671801
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000097
Non hazardousProprietary0.0000110.0555000.001201
Tin solderTin (Sn)7440-31-50.01998899.9400002.161893
subTotal0.020000100.0000002.163191
WireImpurityNon hazardousProprietary0.0000000.0100000.000049
Pure metalGold (Au)7440-57-50.00456099.9900000.493158
subTotal0.004560100.0000000.493208
total0.924560100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.