Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PZU884LS-C6V8-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PZU884LS-C6V8-QSOD882BDDFN1006-20.891480 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934667041315212601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.01444076.0000001.619778
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00198910.4700000.223146
Phenolic resinProprietary0.00257113.5300000.288363
subTotal0.019000100.0000002.131287
DieDoped siliconSilicon (Si)7440-21-30.030000100.0000003.365190
subTotal0.030000100.0000003.365190
Lead FrameCopper alloyCopper (Cu)7440-50-80.37762095.60000042.358774
Magnesium (Mg)7439-95-40.0005920.1500000.066463
Nickel (Ni)7440-02-00.0117712.9800001.320389
Silicon (Si)7440-21-30.0025680.6500000.288004
Pure metal layerGold (Au)7440-57-50.0000400.0100000.004431
Nickel (Ni)7440-02-00.0022520.5700000.252558
Palladium (Pd)7440-05-30.0001580.0400000.017723
subTotal0.395000100.00000044.308341
Mould CompoundFillerSilica -amorphous-7631-86-90.0337557.9800003.786445
Silica fused60676-86-00.33878980.09200038.003002
PigmentCarbon black1333-86-40.0039250.9280000.440328
PolymerEpoxy resin systemProprietary0.0357448.4500004.009456
Phenolic resinProprietary0.0107862.5500001.209954
subTotal0.423000100.00000047.449186
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000101
Non hazardousProprietary0.0000110.0555000.001245
Tin solderTin (Sn)7440-31-50.01998899.9400002.242114
subTotal0.020000100.0000002.243460
WireImpurityNon hazardousProprietary0.0000000.0100000.000050
Pure metalGold (Au)7440-57-50.00448099.9900000.502485
subTotal0.004480100.0000000.502535
total0.891480100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.